Effect of voids on thermomechanical cracking in lead-free...

Microelectronics Reliability 2020 / 06 Vol. 109

Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules

Hagberg, Juha, Nousiainen, Olli, Putaala, Jussi, Salmela, Olli, Raumanni, Juha, Rahko, Matti, Kangasvieri, Tero, Jääskeläinen, Jussi, Galkin, Timo, Jantunen, Heli
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Volume:
109
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113674
Date:
June, 2020
File:
PDF, 4.75 MB
2020
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