Detection of solder bump defects on a flip chip using...

Detection of solder bump defects on a flip chip using vibration analysis

Junchao Liu, Tielin Shi, Qi Xia, Guanglan Liao
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Volume:
7
Language:
english
Pages:
9
DOI:
10.1007/s11465-012-0314-7
Date:
March, 2012
File:
PDF, 565 KB
english, 2012
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