Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth of Cu6Sn5 IMC at cold side Cu-Sn interface.
Kunwar, Anil, Hektor, Johan, Nomoto, Sukeharu, Coutinho, Yuri Amorim, Moelans, NeleJournal:
International Journal of Mechanical Sciences
DOI:
10.1016/j.ijmecsci.2020.105843
Date:
May, 2020
File:
PDF, 1.92 MB
2020
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