A Method for Wafer Defect Detection Using Spatial Feature...

IEEE Access 2020 Vol. 8

A Method for Wafer Defect Detection Using Spatial Feature Points Guided Affine Iterative Closest Point Algorithm

Yang, Jing, Xu, Yi, Rong, Hai-Jun, Du, Shaoyi, Zhang, Hongmei
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Volume:
8
Year:
2020
Journal:
IEEE Access
DOI:
10.1109/ACCESS.2020.2990535
File:
PDF, 3.20 MB
2020
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