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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Influence of copper wire material to corrosion resistant packages and systems for high temperature applications
Klengel, Sandy, Klengel, Robert, Schischka, Jan, Stephan, Tino, Petzold, Matthias, Eto, Motoki, Araki, Noritoshi, Yamada, TakashiYear:
2019
DOI:
10.23919/EMPC44848.2019.8951812
File:
PDF, 2.22 MB
2019