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[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Study on AlN micromachined ultrasonic transducer array with beamforming
Gong, Dan, Chiu, Yihsiang, Ma, Shenglin, Jin, Yufeng, Li, HongbingYear:
2019
DOI:
10.1109/ICEPT47577.2019.245155
File:
PDF, 3.09 MB
2019