[IEEE 2019 IEEE 28th Conference on Electrical Performance...

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[IEEE 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Montreal, QC, Canada (2019.10.6-2019.10.9)] 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System

Kim, Seongguk, Kim, Subin, Cho, Kyungjun, Shin, Taein, Park, Hyunwook, Lho, Daehwan, Park, Shinyoung, Son, Kyungjune, Park, Gapyeol, Kim, Joungho
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Year:
2019
DOI:
10.1109/EPEPS47316.2019.193209
File:
PDF, 1.61 MB
2019
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