![](/img/cover-not-exists.png)
[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Electro-thermal finite element analysis of IGBT module under sinusoidal current load
Wu, Wei, Li, Xianbing, Wang, Liang, Lin, ZhongkangYear:
2019
DOI:
10.1109/ICEPT47577.2019.245348
File:
PDF, 2.57 MB
2019