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Effect of Bi Addition on Tensile Properties of SnâAgâCu Solder at Low Temperature
Hirai, Yukihiko, Oomori, Kouki, Morofushi, Hayato, Shohji, IkuoVolume:
60
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.MH201807
Date:
June, 2019
File:
PDF, 3.18 MB
2019