Cu@Ag nanoparticles doped micron-sized Ag plates for conductive adhesive with enhanced conductivity
Zhang, Jingguo, Liang, Minghui, Hu, Qiang, Ma, Fei, Li, Zhanrong, Wang, Yonghui, Wang, Limin, Zhang, ShaomingJournal:
International Journal of Adhesion and Adhesives
DOI:
10.1016/j.ijadhadh.2020.102657
Date:
June, 2020
File:
PDF, 4.98 MB
2020