Performance-based active wafer clamp design for wafer...

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IEEE Transactions on Semiconductor Manufacturing 2020

Performance-based active wafer clamp design for wafer heating effects in EUV lithography

van den Hurk, David, Weiland, Siep, van Berkel, Koos
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Year:
2020
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2020.3000007
File:
PDF, 7.42 MB
2020
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