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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Formation of Through-Wafer 3-D Interconnects in Fused Silica Substrates by Electrochemical Discharge Machining
Kannojia, Harindra Kumar, Arab, Julfekar, Kumar, Ritesh, Pednekar, Jaisingh, Dixit, PradeepYear:
2019
DOI:
10.1109/eptc47984.2019.9026625
File:
PDF, 851 KB
2019