[IEEE 2020 Pan Pacific Microelectronics Symposium (Pan Pacific) - HI, USA (2020.2.10-2020.2.13)] 2020 Pan Pacific Microelectronics Symposium (Pan Pacific) - Glass Panel Packaging, as the Most Leading-Edge Packaging: Technologies and Applications
Tummala, Rao, Deprospo, Bartlet, Dwarakanath, Shreya, Ravichandran, Siddharth, Nimbalkar, Pratik, Nedumthakady, Nithin, Swaminathan, MadhavanYear:
2020
DOI:
10.23919/PanPacific48324.2020.9059521
File:
PDF, 1.26 MB
2020