Analyses on the large size PBGA packaging reliability under...

Microelectronics Reliability 2020 / 06 Vol. 109

Analyses on the large size PBGA packaging reliability under random vibrations for space applications

Kim, Yeong K., Lee, Seok-min, Hwang, Do-soon, Jang, Seohyun
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Volume:
109
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113654
Date:
June, 2020
File:
PDF, 3.49 MB
2020
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