[IEEE 2019 20th International Conference on Electronic...

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[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Failure Case Analysis and Failure Prevention Method of PhotoMOS Relay Bonding Defect

Zhu, Binruo, Liu, Liyuan, Zhang, Yin, Chen, Jintao, Wang, Xin'gang, Zhao, Fang
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Year:
2019
DOI:
10.1109/ICEPT47577.2019.245194
File:
PDF, 2.96 MB
2019
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