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[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Effect of pressure on nano copper sintering in interconnections of power device
Qian, Jing, Chen, Xianping, Tan, Chunjian, Li, Xiandong, Li, Qiumei, Tao, Luqi, Huang, Yiping, Wu, LingmeiYear:
2019
DOI:
10.1109/ICEPT47577.2019.245788
File:
PDF, 1.35 MB
2019