Reliability hazard characterization of wafer-level spatial...

Microelectronics Reliability 2020 / 04 Vol. 107

Reliability hazard characterization of wafer-level spatial metrology parameters based on LOF-KNN method

Zhang, Jinli, You, Hailong, Jia, Renxu
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Volume:
107
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113599
Date:
April, 2020
File:
PDF, 1.28 MB
2020
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