[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Electromigration Reliability of Au Wire Bonding after Molding
Du, Yahong, Wen, Ming, Liu, Zhi-QuanYear:
2019
DOI:
10.1109/ICEPT47577.2019.245187
File:
PDF, 3.02 MB
2019