Material removal and wear mechanism in abrasive polishing...

  • Main
  • 2020 / 5
  • Material removal and wear mechanism in abrasive polishing...

Material removal and wear mechanism in abrasive polishing of SiO2/SiC using molecular dynamics

Nguyen, Van-Thuc, Fang, Te-Hua
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Journal:
Ceramics International
DOI:
10.1016/j.ceramint.2020.05.263
Date:
May, 2020
File:
PDF, 3.76 MB
2020
Conversion to is in progress
Conversion to is failed