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[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Ultrasound-assisted soldering process performance of Sn-Ag-Ti(Ce, Ga) active solders on thin film ZnO substrate
Sun, Tao, Zhou, Min-Bo, Zhang, Ze-Jun, Zhang, Xin-PingYear:
2019
DOI:
10.1109/ICEPT47577.2019.245215
File:
PDF, 3.13 MB
2019