[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Thermal Property Evaluation of TSV interposer Embedded Microfluidics for Cooling 2.5D Integrated High Power IC Device
Ma, Shenglin, Lian, Tingting, Cai, Han, Hu, Liulin, He, ShuweiYear:
2019
DOI:
10.1109/ICEPT47577.2019.245289
File:
PDF, 3.01 MB
2019