Viscoelastic Warpage Modeling of Fan-Out Wafer Level Packaging During Wafer-level Mold Cure Process
Cheng, Hsien-Chie, Wu, Zong-Da, Liu, Yan-ChengYear:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2020.2992041
File:
PDF, 1.26 MB
2020