[IEEE 2019 20th International Conference on Electronic...

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[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Study on Water Bath Pulling Method Mechanism for Implementing the Equidistant Arrangement of - Ag NWs on Flexible Substrate

Zhang, Lin, Yu, Jiaao, Zhao, Changyao, Li, Mingyu, Ji, Hongjun
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Year:
2019
DOI:
10.1109/icept47577.2019.245241
File:
PDF, 2.87 MB
2019
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