[IEEE 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2019.10.23-2019.10.25)] 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - An Experimental Investigation Into Thin Silicon Die Strength Evaluation
Shih, Hsin-Chih, Tsai, Fila, Shih, Meng-Kai, Tarng, David, Hung, CPYear:
2019
DOI:
10.1109/impact47228.2019.9024976
File:
PDF, 488 KB
2019