Effect of intermetallic compound thickness on mechanical...

Microelectronics Reliability 2020 / 08 Vol. 111

Effect of intermetallic compound thickness on mechanical fatigue properties of copper pillar micro-bumps

Zhu, Wenhui, Shi, Lei, Jiang, Liulu, He, Hu
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Volume:
111
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113723
Date:
August, 2020
File:
PDF, 2.39 MB
2020
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