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Electroless Copper Deposition in a Blind Via Hole of Printed Wiring Board. Uniform Copper Deposition by Axial Temperature Gradient
MATSUSHIMA, Toshifumi, HABAKI, Hiroaki, KAWASAKI, JunjiroVolume:
68
Journal:
Electrochemistry
DOI:
10.5796/electrochemistry.68.568
Date:
July, 2000
File:
PDF, 629 KB
2000