![](/img/cover-not-exists.png)
[IEEE 2020 Joint International Conference on Digital Arts, Media and Technology with ECTI Northern Section Conference on Electrical, Electronics, Computer and Telecommunications Engineering (ECTI DAMT & NCON) - Pattaya, Thailand (2020.3.11-2020.3.14)] 2020 Joint International Conference on Digital Arts, Media and Technology with ECTI Northern Section Conference on Electrical, Electronics, Computer and Telecommunications Engineering (ECTI DAMT & NCON) - Effect of Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices
Sukantharat, Anan, Ugsornrat, Kessararat, Sumithpibul, ChalermsakYear:
2020
DOI:
10.1109/ECTIDAMTNCON48261.2020.9090724
File:
PDF, 1.39 MB
2020