Growth kinetics of Cu surface layers in H 2 O 2 âBTA aqueous solutions
Kondoh, Eiichi, Toyama, Mao, Jin, Linhua, Hamada, Satomi, Shima, Shohei, Hiyama, HirokuniVolume:
59
Journal:
Japanese Journal of Applied Physics
DOI:
10.35848/1347-4065/ab83dd
Date:
July, 2020
File:
PDF, 948 KB
2020