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Diffusion Bonding of Al 6061 and Cu by Hot Isostatic Pressing
Teng, Qing, Li, Xiu, Wei, QingsongVolume:
35
Journal:
Journal of Wuhan University of Technology-Mater. Sci. Ed.
DOI:
10.1007/s11595-020-2242-4
Date:
February, 2020
File:
PDF, 1.69 MB
2020