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[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - SiN used as a Stressor in Germanium-On-Insulator Substrate
Duangchan, Sethavut, Yamamoto, Keisuke, Wang, Dong, Nakashima, Hiroshi, Baba, AkiyoshiYear:
2019
DOI:
10.1109/3DIC48104.2019.9058896
File:
PDF, 1.06 MB
2019