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[IEEE 2019 IEEE 13th International Conference on ASIC (ASICON) - Chongqing, China (2019.10.29-2019.11.1)] 2019 IEEE 13th International Conference on ASIC (ASICON) - 3D Vertical RRAM Array and Device Co-design with Physics-based Spice Model
Xu, Weiiie, Zhao, Yudi, Huang, Peng, Liu, Xiaoyan, Kang, JinfengYear:
2019
DOI:
10.1109/ASICON47005.2019.8983496
File:
PDF, 3.30 MB
2019