[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Thermal Cycling Durability Assessment and Enhancement of FBGA Package for Automotive Applications
Ma, Yiyi, Talledo, Jefferson, Luan, Jing-enYear:
2019
DOI:
10.1109/ICEPT47577.2019.245280
File:
PDF, 1.25 MB
2019