Electromigration Reliability of Advanced High-density...

  • Main
  • 2020
  • Electromigration Reliability of Advanced High-density...
IEEE Transactions on Components Packaging and Manufacturing Technology 2020

Electromigration Reliability of Advanced High-density Fan-out Packaging with Fine-pitch 2lm/2lm L/S Cu Redistribution Line

Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2020.2997824
File:
PDF, 1.61 MB
2020
Conversion to is in progress
Conversion to is failed