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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Ultra-thin polymer spray coating for advanced adhesive bonding applications
Matuskova, B., Gasiorowski, J., Rimbock, J., Zenger, T., Eibelhuber, M., Uhrmann, T.Year:
2019
DOI:
10.23919/EMPC44848.2019.8951815
File:
PDF, 803 KB
2019