Simulation of polymer removal from a powder injection molding compact by thermal debinding
Y. C. Lam, S. C. M. Yu, K. C. Tam, Ying ShengjieVolume:
31
Language:
english
Pages:
10
DOI:
10.1007/s11661-000-0204-1
Date:
October, 2000
File:
PDF, 300 KB
english, 2000