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Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations
Bi, Xiaoyang, Hu, Xiaowu, Li, QinglinVolume:
788
Journal:
Materials Science and Engineering: A
DOI:
10.1016/j.msea.2020.139589
Date:
June, 2020
File:
PDF, 4.72 MB
2020