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A microstructural study of dislocation substructures formed in metal foil substrates during ultrasonic wire bonding
Nikhil Murdeshwar, James E. KrzanowskiVolume:
28
Language:
english
Pages:
9
DOI:
10.1007/s11661-997-0023-8
Date:
December, 1997
File:
PDF, 734 KB
english, 1997