Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging
Bhogaraju, Sri Krishna, Conti, Fosca, Kotadia, Hiren R., Keim, Simon, Tetzlaff, Ulrich, Elger, GordonVolume:
844
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2020.156043
Date:
December, 2020
File:
PDF, 2.40 MB
2020