Novel approach to copper sintering using surface enhanced...

Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging

Bhogaraju, Sri Krishna, Conti, Fosca, Kotadia, Hiren R., Keim, Simon, Tetzlaff, Ulrich, Elger, Gordon
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Volume:
844
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2020.156043
Date:
December, 2020
File:
PDF, 2.40 MB
2020
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