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Fatigue Life Degradation Modeling of SnAgCu Solder Joints after Aging
Athamneh, Raed Al, Hani, Dania Bani, Ali, Haneen, Hamasha, Sa'dYear:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2020.3000355
File:
PDF, 1.35 MB
2020