A Review on Die Attach Materials for SiC-Based...

A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices

Hui Shun Chin, Kuan Yew Cheong, Ahmad Badri Ismail
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Volume:
41
Language:
english
Pages:
9
DOI:
10.1007/s11663-010-9365-5
Date:
August, 2010
File:
PDF, 482 KB
english, 2010
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