A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices
Hui Shun Chin, Kuan Yew Cheong, Ahmad Badri IsmailVolume:
41
Language:
english
Pages:
9
DOI:
10.1007/s11663-010-9365-5
Date:
August, 2010
File:
PDF, 482 KB
english, 2010