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Kinetics and mechanism of electroless copper deposition at moderate-to-high copper ion and low-to-moderate formaldehyde concentrations
K. G. Mishra, R. K. ParamguruVolume:
30
Language:
english
Pages:
7
DOI:
10.1007/s11663-999-0051-4
Date:
April, 1999
File:
PDF, 201 KB
english, 1999