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Fracture of Sn-3.5%Ag solder alloy under creep
V. I. Igoshev, J. I. Kleiman, D. Shangguan, S. Wong, U. MichonVolume:
29
Year:
2000
Language:
english
Pages:
6
DOI:
10.1007/s11664-000-0119-z
File:
PDF, 2.23 MB
english, 2000