Microstructural characterization of inlaid copper...

Journal of Electronic Materials 2001 Vol. 30; Iss. 4

Microstructural characterization of inlaid copper interconnect lines

Paul R. Besser, Ehrenfried Zschech, Werner Blum, Delrose Winter, Richard Ortega, Stewart Rose, Matt Herrick, Martin Gall, Stacye Thrasher, Mike Tiner, Brett Baker, Greg Braeckelmann, Larry Zhao, Cindy
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Volume:
30
Year:
2001
Language:
english
Pages:
11
DOI:
10.1007/s11664-001-0038-7
File:
PDF, 3.63 MB
english, 2001
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