TiN and TaN diffusion barriers in copper interconnect...

Journal of Electronic Materials 2001 Vol. 30; Iss. 4

TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology

Huseyin Kizil, Gusung Kim, Christoph Steinbrüchel, Bin Zhao
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Volume:
30
Year:
2001
Language:
english
Pages:
4
DOI:
10.1007/s11664-001-0041-z
File:
PDF, 231 KB
english, 2001
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