Solder balling of lead-free solder pastes

Journal of Electronic Materials 2002 Vol. 31; Iss. 11

Solder balling of lead-free solder pastes

Minna Arra, Dongkai Shangguan, Erro Ristolainen, Toivo Lepistö
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Volume:
31
Year:
2002
Language:
english
Pages:
9
DOI:
10.1007/s11664-002-0002-1
File:
PDF, 1.29 MB
english, 2002
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