Failure mechanism of lead-free solder joints in flip chip...

Journal of Electronic Materials 2002 Vol. 31; Iss. 11

Failure mechanism of lead-free solder joints in flip chip packages

Fan Zhang, Ming Li, Bavani Balakrisnan, William T. Chen
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Volume:
31
Year:
2002
Language:
english
Pages:
8
DOI:
10.1007/s11664-002-0018-6
File:
PDF, 2.23 MB
english, 2002
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