Effect of multistep annealing on mechanical and surface...

Journal of Electronic Materials 2003 Vol. 32; Iss. 10

Effect of multistep annealing on mechanical and surface properties of electroplated Cu thin films

A. K. Sikder, Ashok Kumar, P. Shukla, P. B. Zantye, M. Sanganaria
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Volume:
32
Year:
2003
Language:
english
Pages:
6
DOI:
10.1007/s11664-003-0085-3
File:
PDF, 271 KB
english, 2003
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