Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects
Shinichi Terashima, Yoshiharu Kariya, Takuya Hosoi, Masamoto TanakaVolume:
32
Year:
2003
Language:
english
Pages:
7
DOI:
10.1007/s11664-003-0125-z
File:
PDF, 206 KB
english, 2003