A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy
Young-Doo Jeon, Sabine Nieland, Andreas Ostmann, Herbert Reichl, Kyung-Wook PaikVolume:
32
Year:
2003
Language:
english
Pages:
10
DOI:
10.1007/s11664-003-0141-z
File:
PDF, 2.20 MB
english, 2003