Preparation of Conductive Particles by Using Electroless...

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 1995 Vol. 10; Iss. 3

Preparation of Conductive Particles by Using Electroless Plating.

HAGIWARA, Ken, SATO, Naoki, HONMA, Hideo
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Volume:
10
Year:
1995
Journal:
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
DOI:
10.5104/jiep1995.10.148
File:
PDF, 6.33 MB
1995
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